SWTest Asia 2023 Program
SWTest Asia 2023 Full eProceedings
Awarded Presentations
Best Overall Presentation
KGD 56G PAM4 High Speed Testing for data center product – Setup Stability Improvement at Wafer Sort
Wei Hoong YAP (Marvell Technology Inc. – Singapore)
Best Data Presentation
3D microprinted probes for testing at sub 20 µm pitch
Wabe KOELMANS, Sam LIN, Anita HUANG, Angus WANG, Edgar HEPP, Francesco COLANGELO, Patrik SCHÜRCH (Exaddon AG – Switzerland)
Chairman’s Welcome to SWTest Asia 2023 Opening Remarks
Jerry Broz, PhD
SWTest General Chair
Delphon – USA
Thursday Keynote Presentation
Advanced Electronic Heterogeneous Integration and Testing
Wei-Chung LO, PhD
Deputy General Director
Electronic and Optoelectronic System Research Laboratories (EOSL)
Industrial Technology Research Institute (ITRI)
Friday Keynote Presentation
Wafer in, SSD out – Famous Last Words of a Test engineer to Manufacturing: “Test All Bits!”
Pradip GHIMIRE
Vice President of Memory Product Solutions
Western Digital, Inc.
Session #1: New Probe MFG
Session Chair: Eric CHIA-CHANG (Intel – USA)
Characteristics of The New Pd-based Alloy for Probe-pins, TK-FS, which has three unique features: High Hardness/High Electrical Conductivity/High Ductility
Takeshi FUSE, Kunihiro SHIMA, and Takeyuki SAGAE (TANAKA KIKINZOKU KOGYO K.K. -Japan)
Application of MD (Molecular Dynamics) methodology in the development and verification of advanced MEMS materials for future wafer probe cards
Young Jun PARK, Jin-Wook JANG, Sang Dan KIM, Song Ho KIM, In Suk LEE, Joon Young CHOI (Korea Instrument – South Korea), Changhyun CHO, Joonyeon KIM (Samsung Electronics – South Korea)
Cutting Cost and Resolution Enabled by Novel Photonic Technologies for Next-Generation Probe Cards Manufacturing
Ksenija VARGA and Thomas UHRMANN (EV Group – Austria)
Session #2: Electrical Challenge
Session Chair: Alan FERGUSON (Oxford Lasers – UK)
Contact Resistance Application in Parametric Testing
Iwan KURNIAWAN, Kar Loong LOW and Thiam Seng YIP (Micron Semiconductor Asia Pte. Ltd. – Singapore)
SiC, GaN and more: Probing Technologies for HV/HC Power Devices
Rainer GAGGL (T.I.P.S. Messtechnik GmbH – Austria)
Current Carrying Capacity Maximization in Probe Cards And the Path to An Unburnable Probe
Hadi NAJAR (Form Factor Inc. – USA)
Session #3: AI in Probing Tech
Session Chair: Muru MEYYAPPAN (Marvell Technology – USA)
Seamless ATE test program generation using a ML approach – Multi-label classification
SenthilKumar DHAMODHARAN, Vaishnavi SARAVANAN, Dinesh ARIVALAGAN, and Lavanya RAJU (Caliber Interconnect Solutions Pvt Ltd – India)
Probes Cleaning Effectiveness challenges for fine pitch and high density Logic Probe Cards with MEMS tips
Wen Jung CHANG (Micron – Taiwan)
Probe Card Maintenance with Artificial Intelligence Assistance System
Adolph CHENG, Ying-Jen CHEN and Anthony FAN (MPI Corporation – Taiwan) Jia-Yu PENG and Prof. Chen-Fu CHIEN (AIMS Research Center, NSTC – Taiwan)
Session #4: Marketing & Innovation
Session Chair: Kenny TANG (TSMC Corporation – Taiwan)
3D microprinted probes for testing at sub 20 µm pitch
Wabe KOELMANS, Sam LIN, Anita HUANG, Angus WANG, Edgar HEPP, Francesco COLANGELO, Patrik SCHÜRCH (Exaddon AG – Switzerland)
Silicon Photonic On-Wafer Test
Choon Leong LOU and Ban Ban LIM (STAr Technologies, Inc. – Taiwan), Soon Leng TAN and Wei Liang SIO (CompoundTek Pte Ltd – Singapore)
Probe Card Market Dynamics and Cost of Test Analysis
Panchami Divakar PHADKE (TechInsights – USA)
Session #5: KGD Technology
Session Chair: Alex YANG (MPI Corporation – Taiwan)
Waveform consideration of shared driver
Shoichi MATSUO (Micron Memory Japan Inc. – Japan)
AMT 5000: KGD Testing at the Die Level Optimized for HBM
Calvin PARK (AMT. CO. LTD. – South Korea)
KGD 56G PAM4 High Speed Testing for data center product – Setup Stability Improvement at Wafer Sort
Wei Hoong YAP (Marvell Technology Inc. – Singapore)
Session #6: High Speed Challenge
Session Chair: Joey WU (SWTest Conference – Taiwan)
High Speed Probe Card architecture for High End Devices
Alberto BERIZZI, Alice GHIDONI, Xin-Reng FOO, Chee-Hoe LIN, Ivan GIUDICEANDREA, Giancarlo BRIVIO, Raffaele VALLAURI (Technoprobe – Italy)
Complex Impedance Matching Structures for Advanced On–Wafer AiP Testing
Pratik GHATE (FormFactor, Inc – USA)