SWTest Asia 2024 Program

Jerry Broz, PhD
SWTest General Chair
Delphon - USA

Silicon Seabelt 2.0: Challenges of Kyushu for Reproduction of Silicon Island

Hiroto Yasuura, PhD
Vice Director-General, National Institute of Informatics - Japan

Critical Role of Test for Image Sensor Development

Shinya Akata
Deputy Senior General Manager of the Design & System Technological Platform Division, Sony Semiconductor Solutions Corporation - Japan

New Wafer Testing Challenges for Leading-Edge SoC Products

Tetsu Ozawa
General Manager of the Production & Quality Management Group, Product Engineering Division, Socionext Inc. - Japan

Novel True-Kelvin MEMS Analytical DC Probes to enable Accurate and Repeatable Characterization of Advanced-Node devices for AI applications

Choon Beng SIA (FormFactor Inc - Singapore), Masa WATANABE (FormFactor Japan - Japan)

Consideration of Resistance with Shared Power line for High Current device

Shoichi MATSUO (Micron Memory Japan Inc. - Japan)

From Lab to Line: Enabling Efficient PIC Testing for Mass Production

Andrew YICK, Andy CHANG, Calvin YANG, Supreet KHANAPET (Marvell - USA), Christian KARRAS, Tobias GNAUSCH (Jenoptik - Germany)

Addressing High-Speed Devices: Strengthening and Advancing MEMS Probe Cards

Yuka HOMAN, Masataka KIMOTO, Shinji TANAKA (MICRONICS JAPAN CO.,LTD - Japan)

A novel memory test system with an electromagnet for STT-MRAM wafer level testing

Masaharu TSUTA, Takaho TANIGAWA, Hiroki KOIKE, Shoji IKEDA, Tetsuo ENDOH (Tohoku University - Japan)
Osamu MORI, Ryoichi UTSUMI, Naoya KOISO, Shigeyuki SATO (Toei Scientific Industrial Co., Ltd.)
Tetsuo KAMIYA, Naoyoshi WATANABE (ADVANTEST Corporation)
Shinichi SAKUYAMA, Masatomo TAKAHASHI (Tokyo Seimitsu Co., Ltd.)

100+K Ultra HIGH Pin Count Probe Card

Zach HSIEH (MPI Corporation - Taiwan)

A Cost-Effective Test Solution for Parametric Test & Reliability Lab

Adam KONICEK (Celadon Systems, Inc. - USA), Ching Too CHEN, Jeff GRUSZYNSKI, Chintankumar PATEL, Jocelyn HSIEH, Jonathon LEE (Chroma ATE, Inc. - USA)

Automated Test Equipment for Battery Management Systems: Challenges and Solutions

Sandeep D'SOUZA (Elevate Semiconductor - USA)

Probing challenge New MEMS probe design to control probe creep/fatigue for high temp probing.

Hiroki KITAMURA, Tomonao NAKASHIMA (Japan Electronic Material Corp - Japan)

Quantum Computing IC Die Level Test Solution at mK-temperature Environment

Alan LIAO (FormFactor - USA), Takuji MIKI (Kobe University - Japan)

Cleaning Innovations to Maximize OEE for High Volume Memory Test

Victoria TRAN (Delphon Industries LLC - USA), Tomonao NAKASHIMA (Japan Electronic Material Corp - Japan)

Improvement of probe-to-wafer contact resistance for inline automated testing for different technologies

Anton GAVRILOV, Geert GOUWY, Van Dievel MARC, Vercaigne GREGOR (imec - Belgium)

“Challenges and Solutions in Wafer Testing” from Viewpoint of Back-End Process of Power Semiconductors

Kai SUZUKI, Masashi HOSHINO, Nobuyuki TOYODA (TESEC Corporation - Japan), Kiyotaka YAMANISHI, Masatomo TAKAHASHI, Naoya TAKEUCHI (Accretech - Japan), Noriyuki IWAMURO (University of Tsukuba - Japan

Enhancing Reliability and Accuracy in High-Speed KGD Testing through Comprehensive System Improvements

Giulia ROTTOLI, Dario VILLA (Technoprobe - Italy)

Accomplishing True Known Good Die Verification Testing in Wafer Test

Yuki HIROSE, Kosuke YAMANISHI (Tokyo Electron Ltd. - Japan)

Space Transformer Organic Technologies for Next-Generation Probe Card Substrates

Yo NOZAKA (FICT Limited - Japan)

On PCB with 50Gbps for ATE board, Characteristic improvement Approach

Takahiro YAGI (OKI Circuit Technology Co., Ltd. - Japan)

Modeling and Simulation of ATE DUT Boards for Large Pin Count Applications

Jose MOREIRA, Michael OTT, Orkide BAIREUTHER, Merlin WALLNER (Advantest - Germany), Natsuki SHIOTA, Aritomo KIKUCHI (Advantest - Japan)

Advanced DUT protection during Avalanche testing on wafer level

Ondrej BETAK, Zdenek SIMERSKY (UNITES Systems a.s. - Czech Republic)

Development of low CTE LTCC material for ST substrates

Takahisa YAMAGUCHI, Eiichi NAKAMURA, Noriyuki YOSHIDA, Shigekatsu KONO (Nippon Electric Glass Co.,Ltd. - Japan)

Introduction of precious metal alloy for Probe-pins materials and mechanical properties of Cu-Ag alloy that product name called TK-101.

Tetsuya KATO, Suganuma RYOSUKE, Takada KAZUYASU (TANAKA KIKINZOKU KOGYO K.K. - Japan)

Testing AI chips and KGD at wafer-level: A new approach for full content test in wafer probing

Klemens REITINGER (ERS electronic GmbH - Germany)

Productivity Enhancements when Drilling Guide Plates for Advanced Vertical Probe Cards - A Comparison between Nanosecond, Picosecond and Femtosecond Pulsed Lasers

Chris STOKES (Oxford Lasers - United Kingdom)

ATE Spring Pin to DUT Board Via Interconnect: Myths and Challenges

Jose MOREIRA (Advantest - Germany)

Wafer test with simultaneous stimulation of sensor devices

Georg FRANZ (T.I.P.S. Messtechnik GmbH - Austria)

Process for Integrating MLOs Manufactured on Digital Lithography Systems

Ksenija VARGA, R HOLLY, T UHRMANN, T ZENGER (EV Group - Austria)
C LEE, Y KUO (EV Group - Taiwan)
C WANG, H CHANG, L CHANG, T YANG (ITRI Industrial Technology Research Institute - Taiwan)
D JANSSEN, M REYBROUCK, M VANDEVYVERE, N VAN HERCK, S VANCLOOSTER (FUJIFILM Electronic Materials (Europe) - Belgium)

Hybrid Bonding Technology for Next-Generation 3D-IC/Chiplets

Tak FUKUSHIMA (Tohoku University - Japan)

3D-IC Fabrication with TSV at the die level from 2D-IC

Jiayi SHEN, Tak FUKUSHIMA (Tohoku University - Japan)

Robust Classifications of WBM Defect Patterns - Multimodal approach

Taiki AI, Sumika ARIMA, Takumi MAEDA, Koichi SUMIYA, Taiki ITO, Daisuke TAKADA (University of Tsukuba - Japan)

More effective high voltage(1,000V) parametric test technique with MEMS probe card

Takao SAEKI (Formfactor Inc - Japan)

Interaction Modeling of High-dimensional Data with the Bias and High Correlation -Sparse Factorization Machines Approach.

Haruki OZAWA, Taiki ITO, Takuya MATSUZAWA, Sara HOSHINO, Kyo WATANABE, Sumika ARIMA (University of Tsukuba - Japan)

New Cleaning Sheet filled with abrasive gel in all cells of melamine sponge.

Tad ROKKAKU (Probe Innovation USA, LLC - USA)

Towards Ultra-High Pin Count Probe Card for high end logic devices

Alice GHIDONI, Elia MISSAGLIA (Technoprobe - Italy), Michael OTT, Markus FAHRNER (Advantest - Germany)

Adjusting Device Temperature Measurement using a Thermocouple Probe Card

Hiroyuki NAKAMURA (Nidec SV Probe - Japan)

Understanding the Factors for Power supply characteristics

Wai Kit K (Lincstech Co., Ltd. - Japan)

Enhancing High-Density Semiconductor Testing with Dual-Head Laser Micro Bonding and Vacuum Gripper Technology

Hong Chul KIM, Gi Jung NAM (DAWON NEXVIEW - South Korea)

A Comprehensive Study on Improving Probe Card Transmission Lines for Effective High-Frequency Wafer-Level Testing

Alessia GALLI, Dario VILLA (Technoprobe - Italy)

New Flying Probe Tester for Probe Cards

Koichi ANDO (HIOKI E.E. CORPORATION - Japan)